Topographic features retained after antibiotic modification of Ti alloy surfaces: Retention of topography with attachment of antibiotics
Document Type
Article
Publication Date
2009
Abstract
Periprosthetic infection is increasingly prevalent in orthopaedics with infection rates of 2% to 15% after total hip arthroplasty. To effectively decrease bacterial attachment, colonization, and subsequent development of periprosthetic infection, we previously described a method to covalently bond vancomycin to smooth Ti alloy surfaces. To attach vancomycin, the Ti surface is first passivated to create a fresh oxide layer. Previously, passivation has been achieved with an H2SO4/H2O2 etch that can destroy the topography of the underlying implant. Passivation by hydrothermal aging as well as by H2SO4/H2O 2 incubation produced a robust oxide layer, but only hydrothermal aging left the geometry unaltered. These hydrothermally passivated Kirschner wires and smooth or beaded Ti surfaces were chemically coupled with vancomycin. Antibiotic-coupled samples representing all three geometries were uniformly covered with antibiotic, resisted colonization by Staphylococcus aureus for longer than 8 hours, and retained their biocompatibility as assessed by normal attachment and morphology of preosteocytic MLO-A5 cells. Using this technique, we believe it is possible to passivate many complex implant designs/geometries as a first step toward covalent bonding of antibiotics or other bioactive factors. © 2009 The Association of Bone and Joint Surgeons.
Publication Title
Clinical orthopaedics and related research
Volume
467
Issue
7
First Page
1678
Last Page
1687
Recommended Citation
Ketonis, C.; Parvizi, J.; Adams, Christopher S.; Shapiro, I. M.; and Hickok, N. J., "Topographic features retained after antibiotic modification of Ti alloy surfaces: Retention of topography with attachment of antibiotics" (2009). PCOM Scholarly Works. 1572.
https://digitalcommons.pcom.edu/scholarly_papers/1572
Comments
This article was published in Clinical orthopaedics and related research, Volume 467, Issue 7, Pages 1678-1687.
The published version is available at http://dx.doi.org/10.1007/s11999-009-0828-4.Copyright © 2009.